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Selective Laser-assisted Transfer of Discrete Components
Scientists working at North Dakota State University (NDSU) have discovered a method for the contactless laser-assisted assembly of discrete components such as ultra-thin, ultra-small semiconductor dies and MEMS components onto rigid and flexible substrates. Laser-direct write techniques are an enabling technology for the ever-decreasing scale of microelectronic...
Published: 11/24/2025
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Inventor(s): Val Marinov, Orven Swenson, Mark Pavicic, Ross Miller, Zhigang Chen, Ferdous Sarwar, Matthew Semler
Keywords(s): CNSE Invention, Electronics & Sensors
Category(s): Technologies > Electronics & Sensors, Technologies > Mechanical/Robotics
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